AI has ushered in a golden age in the semiconductor industry, helping to rethink the most fundamental tenets of chip technology.
FREMONT, CA: Since Artificial Intelligence (AI) is being used in almost all the areas like smartphones, self-driving vehicles, therefore AI chips have become so valuable now. AI chips are the new fad set in the world of computing, and they are set to transform the world with their incredible processing speeds. The future of AI computing performance depends on the development of hardware that meets the fast-growing demands of emerging AI workloads. Realizing this, ASMPT is pleased to work with IBM Research AI Hardware Center to come up with advanced packaging and Heterogeneous Integration solutions for AI hardware research.
As a pioneer in the Advanced Packaging and Heterogeneous Integration solutions, ASMPT is all set to offer a suite of Integrated Solutions for Heterogeneous Integration (including ALSI Laser Saw/Grooving and state-of-the-art interconnect tools, inclusive of collaboration on next-generation hybrid bonding) in support of IBM AI Research. Globally, IBM Research has always been at the forefront in the development of AI-optimized hardware and process innovation globally. Apart from that, ASMPT product solutions can help to improve performance, power, and cost for next-generation AI chips.
The exponential cost of recent silicon scaling has created an inflection point for the industry. It is driving the development of Heterogeneous Integration (HI) to augment step up performance versus comparable Systems on Chip (SoC). This is being achieved through HI's "open" capability to disintegrate and re-integrate silicon and chiplets, allowing flexible choices to achieve optimal performance at significantly lower costs. The timely confluence between IBM's Heterogeneous Integration roadmap and ASMPT's advanced packaging technologies and tools makes us natural strategic collaboration partners to tap the massive potential for innovation and better performance in semiconductor solutions.
ASMPT is also privileged to be among the companies driving the effort of developing the next generation AI chip technology with industry leaders like IBM. ASMPT is a global technology leader providing leading-edge solutions in surface mount technology, equipment, and materials for the semiconductor assembly and packaging industries. Its investment in research and development helps to provide its customers with innovative and cost-efficient solutions and systems that qualify them to achieve higher productivity, greater reliability, and enhanced quality.